Chip scale package (CSP) PCB

Chip scale package (CSP) PCB

1). 100mm x 98mm/1up, FR-4,
2). 1mm +/-0.1mm,6 Layers
3). 1oz copper finished
3). Green solder mask/white legend
4). Min. hole 0.15mm, 4/4 mil track/gap
5). Blind via layer 1-2, via-in-pad.
6). Immersion gold surface finish

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Company Name: Bicheng Enterprise Company
Contact Person: Kevin Liao
Address: 3-203 Shidai Jingyuan, Fuyong, Baoan, Shenzhen, China
Zip: 518103
Telephone: 86 755 27374946
Fax: 86 755 27374847
E-mail: info@bicheng-enterprise.com
Website: http://bicheng1.tradeee.com

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